v1.4.2 - Update for LIPC

Updates to work after LIPC Software Upgrade.

v1.4.1 - minor version bump

Minor documentation additions and version bump. Includes some docstring text on setting up Defaults.py to work with your own ASML machine.

v1.4.0

Includes new functions to find valid cells on-wafer (preventing job conversion errors).
Now can automatically populate wafer with die. Thanks to Miguel Daal for the code.

v1.3.1

Minor updates to plot_reticles() for clarity.

Plotting Enabled

This release can plot the Wafer including alignment marks, and plot reticles, with new commands Job.Plot.plot_wafer() and Job.Plot.plot_reticles().

Plotting options can be found in Defaults.py.

plot_reticles():

plot_wafer():

Multi-layer Alignment

This release enables the following:

• Multi-layer alignment (global and optical)
• Alignment mark exposures
• Pre-defined image libraries (implemented for alignment mark Image definitions)

The new "Example02" file has been tested by exposing a wafer on our system, and performing 2nd layer alignment/exposure.

v1.1.1: Wafer Layout plotting

Now can generate wafer layout preview, like so:

Plotting command added to Example01.

v1.1.0: First working version

Uncovered and fixed bugs when jobs were converted and executed for exposure on an ASML PAS 5500/300 stepper system. This release is confirmed to produce good exposures on the stepper and has been tested on jobs requiring complex stitching.

This release supports multiple Layers and multiple Images per layer with arbitrary wafer placement, but does not yet support alignment, alignment mark exposure or optical prealignment. (See branch AlignmentDev for progress on Alignment.)

v1.0.0

Exports working and tested without alignment. Alignment classes are written but untested.