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sch: update opendeck 3.1 schematics
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replace SOIC-24 package for the multiplexers with TSSOP-24
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paradajz committed Oct 7, 2023
1 parent 4c7766b commit 17540d3
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Showing 32 changed files with 79,272 additions and 90,620 deletions.
31 changes: 20 additions & 11 deletions bin/sch/opendeck/v2.2.1/OpenDeck-r2.2.1.kicad_pro
Original file line number Diff line number Diff line change
@@ -1,5 +1,6 @@
{
"board": {
"3dviewports": [],
"design_settings": {
"defaults": {
"board_outline_line_width": 0.09999999999999999,
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"zones_allow_external_fillets": false,
"zones_use_no_outline": true
},
"layer_presets": []
"layer_presets": [],
"viewports": []
},
"boards": [],
"cvpcb": {
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"net_settings": {
"classes": [
{
"bus_width": 12.0,
"bus_width": 12,
"clearance": 0.127,
"diff_pair_gap": 0.25,
"diff_pair_via_gap": 0.25,
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"track_width": 0.2032,
"via_diameter": 0.8,
"via_drill": 0.4,
"wire_width": 6.0
"wire_width": 6
},
{
"bus_width": 12.0,
"bus_width": 12,
"clearance": 0.127,
"diff_pair_gap": 0.25,
"diff_pair_via_gap": 0.25,
Expand All @@ -381,22 +383,29 @@
"microvia_diameter": 0.3,
"microvia_drill": 0.1,
"name": "Power",
"nets": [
"+5V",
"Net-(FB1-Pad2)"
],
"pcb_color": "rgba(0, 0, 0, 0.000)",
"schematic_color": "rgba(0, 0, 0, 0.000)",
"track_width": 0.305,
"via_diameter": 0.8,
"via_drill": 0.4,
"wire_width": 6.0
"wire_width": 6
}
],
"meta": {
"version": 2
"version": 3
},
"net_colors": null
"net_colors": null,
"netclass_assignments": null,
"netclass_patterns": [
{
"netclass": "Power",
"pattern": "+5V"
},
{
"netclass": "Power",
"pattern": "Net-(FB1-Pad2)"
}
]
},
"pcbnew": {
"last_paths": {
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