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Copy pathTrackerDiskModuleOut.xml
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TrackerDiskModuleOut.xml
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<lccdd>
<!-- Build slices top-down from innermost slice (closest to IP) to outer-most (away from IP)-->
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="2.800*mm" material="Rohacell_IG51" info="Structure and cooling: Core" sensitive="false"/>
<module_component thickness="0.700*mm" material="Allcomp_K9" info="Structure and cooling: Carbon Foam" sensitive="false"/>
<module_component thickness="0.068*mm" material="Kapton" info="Structure and cooling: Cooling Pipe" sensitive="false"/>
<module_component thickness="0.235*mm" material="Water" info="Structure and cooling: Cooling fluid" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Structure and cooling: Glue layer" sensitive="false"/>
<module_component thickness="0.025*mm" material="CarbonFiber" info="Structure and cooling: Interface" sensitive="false"/>
<module_component thickness="0.150*mm" material="CarbonFiber" info="Structure and cooling: CF Skins" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Silicon" info="Module: Sensor" sensitive="true"/>
<module_component thickness="0.100*mm" material="Silicon" info="Module: r/o ASIC" sensitive="false" />
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Aluminium" info="Module: FPC metal layer" sensitive="false"/>
<module_component thickness="0.050*mm" material="Kapton" info="Module: FPC insulating layer" sensitive="false"/>
<module_component thickness="0.100*mm" material="Epoxy" info="Glue: Eccobond" sensitive="false"/>
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
<module_component thickness="0.200*mm" material="Aluminium" info="Power bus: Conductor" sensitive="false"/>
<module_component thickness="0.100*mm" material="Kapton" info="Power bus: Insulating layer" sensitive="false"/>
</lccdd>